Qualcomm: >> Snapdragon 660 Mobile Platform Firmware Security Vulnerabilities
Memory corruption while creating a fence to wait on timeline events, and simultaneously signal timeline events.
CVSS Score
8.4
EPSS Score
0.001
Published
2024-08-05
Transient DOS while parsing ESP IE from beacon/probe response frame.
CVSS Score
7.5
EPSS Score
0.004
Published
2024-08-05
Transient DOS while decoding attach reject message received by UE, when IEI is set to ESM_IEI.
CVSS Score
7.5
EPSS Score
0.003
Published
2024-08-05
Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released.
CVSS Score
8.4
EPSS Score
0.002
Published
2024-07-01
Memory corruption when allocating and accessing an entry in an SMEM partition.
CVSS Score
7.8
EPSS Score
0.001
Published
2024-07-01
Memory corruption while performing finish HMAC operation when context is freed by keymaster.
CVSS Score
8.4
EPSS Score
0.001
Published
2024-07-01
Transient DOS while parse fils IE with length equal to 1.
CVSS Score
7.5
EPSS Score
0.001
Published
2024-02-06
Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL.
CVSS Score
7.5
EPSS Score
0.001
Published
2024-02-06
Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame.
CVSS Score
7.5
EPSS Score
0.001
Published
2024-02-06
Memory corruption while processing the event ring, the context read pointer is untrusted to HLOS and when it is passed with arbitrary values, may point to address in the middle of ring element.
CVSS Score
7.8
EPSS Score
0.001
Published
2024-02-06