Qualcomm: >> Snapdragon W5+ Gen 1 Wearable Platform Security Vulnerabilities
Memory corruption during dynamic process creation call when client is only passing address and length of shell binary.
CVSS Score
7.8
EPSS Score
0.0
Published
2025-06-03
Information disclosure may occur while decoding the RTP packet with improper header length for number of contributing sources.
CVSS Score
8.2
EPSS Score
0.0
Published
2025-06-03
Information disclosure may occur while decoding the RTP packet with invalid header extension from network.
CVSS Score
8.2
EPSS Score
0.0
Published
2025-06-03
Information disclosure may occur while processing goodbye RTCP packet from network.
CVSS Score
8.2
EPSS Score
0.0
Published
2025-06-03
Information disclosure when an invalid RTCP packet is received during a VoLTE/VoWiFi IMS call.
CVSS Score
8.2
EPSS Score
0.0
Published
2025-06-03
Memory corruption while processing I2C settings in Camera driver.
CVSS Score
6.6
EPSS Score
0.0
Published
2025-06-03
Memory corruption may occur while processing the OIS packet parser.
CVSS Score
6.6
EPSS Score
0.0
Published
2025-06-03
Memory corruption occurs while connecting a STA to an AP and initiating an ADD TS request.
CVSS Score
7.5
EPSS Score
0.001
Published
2025-04-07
Transient DOS while connecting STA to AP and initiating ADD TS request from AP to establish TSpec session.
CVSS Score
7.5
EPSS Score
0.001
Published
2025-04-07
Memory corruption may occur while initiating two IOCTL calls simultaneously to create processes from two different threads.
CVSS Score
7.8
EPSS Score
0.0
Published
2025-04-07